alcatel Go Flip 3 Full Specifications

network
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  • Technology GSM / CDMA / HSPA / LTE
  • 2G bands GSM 850 / 900 / 1800 / 1900
  • CDMA 800 / 1900
  • 3G bands HSDPA 850 / 1700(AWS) / 1900
  • 4G bands 2, 4, 5, 12, 25, 26, 41, 66, 71
  • Speed HSPA, LTE
launch
  • Announced 2019, September 19
  • Status Available. Released 2019, September 19
body
  • Dimensions 104.9 x 53.1 x 20.1 mm (4.13 x 2.09 x 0.79 in)
  • Weight 118 g (4.16 oz)
  • SIM Nano-SIM
display
  • Type TN TFT
  • Size 2.8 inches, 24.3 cm2 (~43.6% screen-to-body ratio)
  • Resolution 240 x 320 pixels, 4:3 ratio (~143 ppi density)
  • Second external TN TFT display, 1.44 inches, 128 x 128 pixels
platform
  • OS KaiOS 2.5
  • Chipset Qualcomm MSM8909 Snapdragon 210 (28 nm)
  • CPU Quad-core 1.1 GHz Cortex-A7
  • GPU Adreno 304
memory
  • Card slot microSDHC (dedicated slot)
  • Internal 4GB 512MB RAM
main camera
  • Modules 2 MP
  • Video 720p@30fps
selfie camera
  • Modules
sound
  • Loudspeaker Yes
  • 3.5mm jack Yes
comms
  • WLAN Wi-Fi 802.11 b/g/n, hotspot
  • Bluetooth 4.2, A2DP
  • GPS No
  • NFC No
  • Radio FM radio
  • USB microUSB 2.0
features
  • Sensors
battery
  • Li-Ion 1350 mAh, removable
misc
  • Colors Prime Black
  • SAR 1.28 W/kg (head)     1.16 W/kg (body)