TSMC Starts 7nm+ Process Mass Production For Kirin 985, Apple A13 SoCs

TSMC has confirmed that it will begin the second-gen 7nm+ process mass production. It is also the first Taiwanese company to implement EUV lithography, which makes a step towards becoming the major competitor of Samsung and Intel.

As per Chinese reports, TSMC plans to continue providing Huawei and its new process is expected to be applied for the Kirin 985 SoC in Huawei Mate 30. Also, it will be also be used for the A13 chipset of Apple, which will be introduced in iPhones 11.

Although the trade war between China and the U.S is escalating at present, TSMC still stated that it plans to continue to cooperate with Huawei in chipset supply. As the company is a Taiwanese company, not mainland Chinese one, it holds independent trade agreements with economic superpowers as well as isn’t affected any ongoing issues.

In a statement, the company has revealed its plans in the future. It is known that currently, the company is beginning its trial production of the 5nm process wafers with the introduction of EUV technology. The mass production is expected to begin in the first quarter of 2020. Therefore, the company’s chipsets can be released in June next year.

The company is also relocating a new factory in the Southern Science and Technology Park in this country, which is set to get new installations for the manufacturing process. Meanwhile, its old plant for R&D will begin preparing for the 3nm processes.

Besides TSMC’s current plans, the company also aims to produce a 6nm process in its works, which is probably an upgrade of the 7nm+ process in shipped devices.

The TMSC’s announcement came after the company said it would still deliver semiconductors to Huawei, even when ARM severed the ties with this Chinese tech giant. Other companies that do not violate the U.S ban on Huawei, will continue delivering products to this company consist of Lenovo Group, and Panasonic.