Qualcomm Snapdragon 865, 765 Chips Come With Built-In 5G

Anil Singh


Strikingly, the flagship Snapdragon 865 doesn’t appear to be the star amongst other newcomers.

Having been planned by several big names in the tech industry, 2020 will become a milestone for many tech-savvy people with upcoming flagship devices and cutting-edge technology. As part of that, Qualcomm recently introduced its latest set of 5G chips, including Snapdragon 765, game-focused Snapdragon 765G, and Snapdragon 865. This means the company has outlined a landscape for not only numerous 2020’s Android smartphones but also 5G devices in the future.

In a nutshell, the American chipmaker said those processors will improve performance in notable categories like AI-based features or 8K video.

In a nutshell, the American chipmaker said those processors will improve performance in notable categories like AI-based features or 8K video. Though the 865 chip is the highest-end model, it doesn’t appear to be the star amongst other newcomers. In the very beginning, most users aren’t willing to spend a large budget for a 5G handset while the upper mid-range 765 chips could give them an alternative solution as a 5G systems-on-a-chip. This likely promises to offer people more affordable 5G devices and to extend battery life as well. With Snapdragon 765, we’ll no longer have to use any separate, power-hungry modem to keep up with the next-generation wireless network.

On the other hand, when these handsets will hit the market is up to each manufacturer.

On the other hand, when these handsets will hit the market is up to each manufacturer. As of now, Snapdragon 865 will reportedly arrive in Xiaomi Mi 10 and an unknown OPPO flagship in early 2020. In the meantime, Nokia devices will feature Snapdragon 765 chipsets and Motorola has planned to use both the chipsets for its product line.

On the sidelines, Qualcomm also unveiled a next-generation sensor namely 3D Sonic Max. As promoted, the sensor boasts of a 17-time larger recognition area compared to its predecessor - thanks to the ultrasonic tech it packs inside.

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