A New Material Was Found To Solve Devices' Overheating Problem

Researchers in Melbourn, Australia have recently developed a thermally conductive and chemically stable material to cope with the overheating problems of modern devices. This advance will enable the next-gen foldable phone, miniaturized electronics as well as wearable technology.

Researchers from Japan and Northern Ireland, together with Melbourne-based Deakin University's Institute for Frontier Material's scientists have spent seven years learning and developing this new material.

Alfred and Luhua, who are IFM researchers, mentioned that the management of the heat has always been a problematic issue, particularly in miniaturized devices.

Li declared that the management of the heat is essential. Users can tell if their devices are overheated and not working correctly.

The demand for emerging technology and miniaturization are increasing day by day. With that comes the demand for thermal cooling to ensure the safety, longevity, reliability, and performance of different products.

Li strongly believes that this material is a crucial breakthrough. With the time to come and more in-depth research, it will surely widen the knowledge about what electronic devices are capable of. To be more specific, the next generation of devices needs flexibility.

Scientists are still in search of alternatives for copper and aluminum. This might be hard for them, given the fact that they are conductive and might result in problems regarding short circuit.

Li mentioned that:

Boron nitride (BN) – a chemical compound was taken, and they shaved it to an atomically-thin level. They have had some initial success with increasing its cooling capabilities and thermal conductivity using this material.

Li stated that these BN chemicals’ thermal conductivity was better than many other semiconductors as well as insulators. They also have excellent impermeability, great stability, stretchability, high flexibility, outstanding strength, and low density, which makes them promising material for the dissipation of heat on wearable devices.

As stated by the researchers, this new material’s thermal conductivity was double that of copper.