Compare specs
Honor Magic V Flip
network
- Technology GSM / CDMA / HSPA / CDMA2000 / LTE / 5G
- 2G bands GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
- 3G bands HSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100
- 4G bands LTE
- Speed HSPA, LTE, 5G
launch
- Announced 2024, June 13
- Status Coming soon. Exp. release 2024, June 19
body
- Dimensions Unfolded: 167.3 x 75.6 x 7.2 mm Folded: 86.5 x 75.6 x 14.9 mm
- Weight 193 g (6.81 oz)
- Build Aluminum frame
- SIM Dual SIM (Nano-SIM, dual stand-by)
display
- Type Foldable LTPO OLED, 1B colors, 120Hz, HDR, Dolby Vision, BT.2020, 3000 nits (peak)
- Size 6.8 inches, 108.0 cm2 (~85.4% screen-to-body ratio)
- Resolution 1080 x 2520 pixels, 21:9 ratio (~403 ppi density)
platform
- OS Android 14, MagicOS 8
- Chipset Qualcomm SM8475 Snapdragon 8+ Gen 1 (4 nm)
- CPU Octa-core (1x3.0 GHz Cortex-X2 & 3x2.5 GHz Cortex-A710 & 4x1.80 GHz Cortex-A510)
- GPU Adreno 730
memory
- Card slot No
- Internal 256GB 12GB RAM, 512GB 12GB RAM, 1TB 12GB RAM, 1TB 16GB RAM
main camera
- Modules 50 MP, f/1.9, 23mm (wide), 1/1.56", 1.0µm, PDAF, OIS 12 MP, f/2.2, 112˚ (ultrawide), AF
- Features LED flash, HDR, panorama
- Video 4K, 1080p, gyro-EIS
selfie camera
- Modules 50 MP, f/2.0, (wide), AF
- Video 4K, 1080p
sound
- Loudspeaker Yes, with stereo speakers
- 3.5mm jack No
comms
- WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
- Bluetooth 5.3, A2DP, LE, aptX HD
- GPS GPS, GALILEO, GLONASS, QZSS, BDS (B1I+B1c)
- NFC Yes
- USB USB Type-C 2.0, OTG
features
- Sensors Fingerprint (side-mounted), gyro, accelerometer, proximity (ultrasonic), compass
battery
- Si/C 4800 mAh, non-removable
- Charging 66W wired, 45% in 15 min (advertised) 5W reverse wired
misc
- Colors Black, White, Champagne, Green