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Honor Magic V Flip

Honor Magic V Flip

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network
  • Technology GSM / CDMA / HSPA / CDMA2000 / LTE / 5G
  • 2G bands GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
  • 3G bands HSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100
  • 4G bands LTE
  • Speed HSPA, LTE, 5G
launch
  • Announced 2024, June 13
  • Status Coming soon. Exp. release 2024, June 19
body
  • Dimensions Unfolded: 167.3 x 75.6 x 7.2 mm Folded: 86.5 x 75.6 x 14.9 mm
  • Weight 193 g (6.81 oz)
  • Build Aluminum frame
  • SIM Dual SIM (Nano-SIM, dual stand-by)
display
  • Type Foldable LTPO OLED, 1B colors, 120Hz, HDR, Dolby Vision, BT.2020, 3000 nits (peak)
  • Size 6.8 inches, 108.0 cm2 (~85.4% screen-to-body ratio)
  • Resolution 1080 x 2520 pixels, 21:9 ratio (~403 ppi density)
platform
  • OS Android 14, MagicOS 8
  • Chipset Qualcomm SM8475 Snapdragon 8+ Gen 1 (4 nm)
  • CPU Octa-core (1x3.0 GHz Cortex-X2 & 3x2.5 GHz Cortex-A710 & 4x1.80 GHz Cortex-A510)
  • GPU Adreno 730
memory
  • Card slot No
  • Internal 256GB 12GB RAM, 512GB 12GB RAM, 1TB 12GB RAM, 1TB 16GB RAM
main camera
  • Modules 50 MP, f/1.9, 23mm (wide), 1/1.56", 1.0µm, PDAF, OIS 12 MP, f/2.2, 112˚ (ultrawide), AF
  • Features LED flash, HDR, panorama
  • Video 4K, 1080p, gyro-EIS
selfie camera
  • Modules 50 MP, f/2.0, (wide), AF
  • Video 4K, 1080p
sound
  • Loudspeaker Yes, with stereo speakers
  • 3.5mm jack No
comms
  • WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
  • Bluetooth 5.3, A2DP, LE, aptX HD
  • GPS GPS, GALILEO, GLONASS, QZSS, BDS (B1I+B1c)
  • NFC Yes
  • USB USB Type-C 2.0, OTG
features
  • Sensors Fingerprint (side-mounted), gyro, accelerometer, proximity (ultrasonic), compass
battery
  • Si/C 4800 mAh, non-removable
  • Charging 66W wired, 45% in 15 min (advertised) 5W reverse wired
misc
  • Colors Black, White, Champagne, Green